SMT PCB assembly
Surface-mount components are placed on the PCB and soldered by vapor phase reflow using a controlled Galden temperature profile.
SMT equipment
We run three SMT lines with backup capacity for all key machines.
- Automatic stencil printing EKRA X4, X5 and X5 Professional with integrated solder paste inspection
- Pick-and-place systems Mycronic MY300DX-14, MY200DX-10, MY100SX-10
- Components from size 01005
- Japanese Almit SAC305 solder
Checks during placement
During setup and placement, the machines verify component parameters and save a placement log for each PCB.
- Resistance, capacitance, inductance and forward-voltage measurement
- Basic checks of FET and IGBT devices
- Polarity verification for every component
- Placement log with measurement results
A qualified technician monitors each line and deals with any deviation. Boards are visually checked before and after reflow.
Solder materials and process control
We use Japanese Almit SAC305 solder paste. Before each order, the paste is brought to working temperature and machine-mixed for consistent printing and reflow.
The same solder system is used for SMT and THT processes. This simplifies process qualification and keeps solder joint behavior consistent across the assembly.
Vapor phase reflow at 237 °C
Reflow takes place in Galden vapor. The boiling point of the fluid limits the maximum temperature to 237 °C, so the PCB and components cannot be heated above that point.
Vapor phase reflow heats the whole PCB evenly. It is particularly useful for boards with different thermal masses, large ground planes or temperature-sensitive components.
Redundant equipment and planned maintenance
Backup machines are available for all critical operations. A single equipment failure does not have to stop the order.
Preventive maintenance is scheduled outside production time to avoid disrupting active orders.
Have a project to discuss?
Call us or send us your files.