Cleaning and board protection
Chemical cleaning is part of our standard process. Conformal coating, adhesive component bonding and potting are added when required by the operating environment.
Chemical cleaning
All assemblies are chemically cleaned with a two-stage rinse. The cleaning fluid is matched to the Almit fluxes used in production and removes soldering residues effectively.
We monitor the final rinse and keep its conductivity below 8 µS. Cleaning is done on DCT InJet 388 and InJet 878 systems.
Conformal coating and component bonding
A UV-traceable polyurethane coating can be applied selectively to protect solder joints and conductive tracks from moisture, dust, chemicals and condensation.
SMD and THT components can also be secured with adhesive to improve mechanical resistance in demanding applications.
- Selective UV-traceable polyurethane conformal coating
- Adhesive securing of SMD and THT components
- Protection from moisture, dust and chemicals
Have a project to discuss?
Call us or send us your files.